NTA4151P, NTE4151P
PACKAGE DIMENSIONS
SC ? 89, 3 ? LEAD
CASE 463C ? 03
ISSUE C
1
A
? X ?
3
2
B ? Y ? S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 463C ? 01 OBSOLETE, NEW STANDARD 463C ? 02.
M
K
G
2 PL
D
0.08 (0.003) M
C
3 PL
X Y
J
N
? T ?
SEATING
PLANE
DIM
A
B
C
D
G
H
J
K
L
M
N
S
MILLIMETERS
MIN NOM MAX
1.50 1.60 1.70
0.75 0.85 0.95
0.60 0.70 0.80
0.23 0.28 0.33
0.50 BSC
0.53 REF
0.10 0.15 0.20
0.30 0.40 0.50
1.10 REF
??? ??? 10 _
??? ??? 10 _
1.50 1.60 1.70
MIN
0.059
0.030
0.024
0.009
0.004
0.012
???
???
0.059
INCHES
NOM MAX
0.063 0.067
0.034 0.040
0.028 0.031
0.011 0.013
0.020 BSC
0.021 REF
0.006 0.008
0.016 0.020
0.043 REF
??? 10 _
??? 10 _
0.063 0.067
SOLDERING FOOTPRINT*
H
H
L
G
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NTA4151P/D
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